| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Jan 2022 | SERC | Institute of Microelectronics | Low Temperature Physical Vapour Deposited Cu Seed Layer for Temporary Bonded Wafer Substrates | Abdul Hannan Yeo, Serine Soh Siew Boon, David Ho Soon Wee, Kalyn Lim Tien Shee, Wei Jun Qi, Zhang Kang, Kelvin Boh Tai Ming, Cheng Ting | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |