| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Jan 2022 | SERC | Institute of Microelectronics | Nonlinear Thermal Stress/Strain Analyses of Through SiC Via | C.L. Alan Lee, Xiaowu Zhang, Haoran Chen | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |