| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Sep 2013 | SERC | Institute of Microelectronics | Antenna-in-Package Design Based on Wafer-Level Packaging With Through Silicon Via Technology | Cheng Jin, V.N Sekhar, Xiaoyue Bao, Bangtao Chen, Boyu Zheng, Rui Li | IEEE Transactions on Components, Packaging and Manufacturing Technology |