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Publication date Communities Collections Article title Author(s) Journal/Conference
2 Aug 2022 SERC Advanced Remanufacturing and Technology Centre A novel low-cost capacitance-based approach for non-destructive evaluation of powder quality for food processing industries HARI KRISHNA SALILA VIJAYALAL MOHAN, Andrew Alexander Malcolm Measurement: Sensors
20 Feb 2022 SERC Advanced Remanufacturing and Technology Centre A novel low-cost contactless capacitive evaluation approach for capping integrity assessment of food and beverage containers HARI KRISHNA SALILA VIJAYALAL MOHAN, Choon Hong Toh, Andrew Alexander Malcolm Sensors and Actuators Reports
30 Dec 2021 SERC Advanced Remanufacturing and Technology Centre Non-destructive Evaluation of Flexible Sachet Seal Integrity Using a Capacitive Proximity Sensor Hari Krishna Salila Vijayalal Mohan, Choon Hong Toh, Andrew Alexander Malcolm 2021 IEEE Industrial Electronics and Applications Conference (IEACon)
30 Nov 2021 SERC Advanced Remanufacturing and Technology Centre Non-Destructive Evaluation of Container Capping Integrity Using Capacitive Proximity Sensor Hari Krishna Salila Vijayalal Mohan, Choon Hong Toh, Andrew Alexander Malcolm 2021 5th International Conference on Electronics, Materials Engineering & Nano-Technology (IEMENTech)
14 Sep 2021 SERC Advanced Remanufacturing and Technology Centre Non-Destructive Evaluation of Food and Beverage (F&B) Fast Moving Consumer Goods (FMCG) Using Capacitive Proximity Sensor HARI KRISHNA SALILA VIJAYALAL MOHAN, Andrew Alexander Malcolm 2021 IEEE Sensors Applications Symposium (SAS)
9 Jul 2021 SERC Advanced Remanufacturing and Technology Centre Internal surface roughness measurement of metal additively manufactured samples via x-ray CT: the influence of surrounding material thickness Joseph John Lifton, Yuchan Liu, Zheng Jie Tan, Bisma Mutiargo, Xue Qi Goh, Andrew Alexander Malcolm Surface Topography: Metrology and Properties
9 Dec 2020 SERC Advanced Remanufacturing and Technology Centre Capacitance-based Contactless Monitoring of Aseptic Package Integrity and Content Quality HARI KRISHNA SALILA VIJAYALAL MOHAN, ANDREW ALEXANDER MALCOLM, Fang Cheng 2020 IEEE SENSORS
9 Dec 2020 SERC Advanced Remanufacturing and Technology Centre A Low-Cost Capacitance-based Non-Destructive Evaluation Platform for Fast Moving Consumer Goods (FMCG) Industrial Applications HARI KRISHNA SALILA VIJAYALAL MOHAN, ANDREW ALEXANDER MALCOLM, Fang Cheng 2020 IEEE SENSORS
14 Nov 2020 SERC Advanced Remanufacturing and Technology Centre Low-cost contactless monitoring of aseptic package integrity and content quality using capacitance HARI KRISHNA SALILA VIJAYALAL MOHAN, ANDREW ALEXANDER MALCOLM, Fang Cheng Food Packaging and Shelf Life
22 Jan 2020 SERC Advanced Remanufacturing and Technology Centre Ultrasonic detection and characterization of delamination and rich resin in thick composites with waviness Zhen Zhang, Shifeng Guo, Qian Li, Fangsen Cui, Andrew Alexander Malcolm, Zhongqing Su, Menglong Liu Composites Science and Technology
22 Jan 2020 SERC Advanced Remanufacturing and Technology Centre Ultrasonic detection and characterization of delamination and rich resin in thick composites with waviness Zhen Zhang, Shifeng Guo, Qian Li, Fangsen Cui, Andrew Alexander Malcolm, Zhongqing Su, Menglong Liu Composites Science and Technology
27 Mar 2019 SERC Advanced Remanufacturing and Technology Centre Defect Detection using Trainable Segmentation Bisma Mutiargo, Amin Garbout, Andrew Alexander Malcolm International Forum on Medical Imaging in Asia 2019