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26 Jun 2024 SERC Institute of Microelectronics A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers (Pending publish) Sajay Bhuvanendran Nair Gourikutty, Jiaqi Wu, Teck Guan Lim, San Sandra, Ming Chinq Jong, Chia Lai Yee, Lau Boon Long, David Soon Wee Ho, Chong Ser Choong, Ding Liang, Xiaoguang Tu, Wanjun Wang, Chee-Keong Tan, Alison See, Hsiu-Che Wang, Roberto Coccioli, Ronson Tan, Radhakrishnan Nagarajan, Surya Bhattacharya 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
1 Apr 2024 SERC Institute of Microelectronics 77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing Mei Sun, Teck Guan Lim, David Soon Wee Ho, Jiaqi Wu, Tai Chong Chai, Yugang Ma IEEE Transactions on Components, Packaging and Manufacturing Technology
18 Mar 2024 SERC Institute of Microelectronics Development of Flip-Chip Packaging for Monolithic Microwave Integrated Circuit (Pending publish) Leong Ching Wai, Teck Guan Lim, Ser Choong Chong, Lin Zhou 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres Sajay Bhuvanendran Nair Gourikutty, Lau Boon Long, Seit Wen Wei, Ming Chinq Jong, David Soon Wee Ho, Jiaqi Wu, Teck Guan Lim, Rathin Mandal, Chong Ser Choong, Chia Lai Yee, Xin Li, Jason Tsung-Yang Liow, Surya Bhattacharya 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer Teck Guan Lim, Lin Zho, Sasi Kumar Tippabhotla, Ji Lin, Jong Ming Chinq, Jiaqi Wu, Tang Gongyue, Eva Wai Leong Ching, Yong Chyn Ng, King Jien Chui, Wei Jia Lu, Chee Heng Goh, Sek Lin Pek, Jun Wei Agnes Loh 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022 SERC Institute of Microelectronics Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna, David Soon Wee Ho, Jiaqi Wu, Rathin Mandal, Nanxi Li, Teck Guan Lim, Jason Tsung-Yang Liow, Surya Bhattacharya 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute for Infocomm Research FOWLP AiP Optimization for Automotive Radar Applications Mei Sun, Teck Guan Lim, Tai Chong Chai, Surya Bhattacharya, Yugang Ma 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Passive Devices Fabrication on FOWLP and Characterization for RF Applications Chunmei Wang, King Jien Chui, Xiangyu Wang, Teck Guan Lim, Mingbin Yu, Gilbert See, Gu Yu 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Sep 2013 SERC Institute of Microelectronics Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration Cheng Jin, Siong Chiew Ong, Teck Guan Lim, Ka Fai Chang, Soon Wee Ho IEEE Transactions on Components, Packaging and Manufacturing Technology