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5 Jan 2022
SERC
Institute of Microelectronics
Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers
Sajay Bhuvanendran Nair Gourikutty,
Ming Chinq Jong,
Chockanathan Vinoth Kanna,
David Soon Wee Ho,
Jiaqi Wu,
Rathin Mandal,
Nanxi Li,
Teck Guan Lim,
Jason Tsung-Yang Liow,
Surya Bhattacharya
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021
SERC
Institute for Infocomm Research
FOWLP AiP Optimization for Automotive Radar Applications
Mei Sun,
Teck Guan Lim,
Tai Chong Chai,
Surya Bhattacharya,
Yugang Ma
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
30 May 2017
SERC
Institute of Microelectronics
Passive Devices Fabrication on FOWLP and Characterization for RF Applications
Chunmei Wang,
King Jien Chui,
Xiangyu Wang,
Teck Guan Lim,
Mingbin Yu,
Gilbert See,
Gu Yu
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Sep 2013
SERC
Institute of Microelectronics
Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration
Cheng Jin,
Siong Chiew Ong,
Teck Guan Lim,
Ka Fai Chang,
Soon Wee Ho
IEEE Transactions on Components, Packaging and Manufacturing Technology
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