Tang, G., Ye, Y. L., Ching Wai, L., & Han, Y. (2023, December 5). Transient Thermal Characterization and Analysis for Next Generation SiC Power Module. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc59621.2023.10457921
Abstract:
Power modules play a pivotal role in modern electrical systems, enabling efficient energy conversion and delivery in various applications. Silicon carbide (SiC)-based power modules, with their superior material properties, have emerged as a cutting-edge solution, offering higher efficiency, power density, and temperature tolerance. Nonetheless, the compact form factor of SiC devices poses significant thermal management challenges. This paper introduces a SiC device-based power module with dual-side cooling capability. We present and demonstrate a systematic approach to evaluating its transient thermal characteristics under power cycling conditions. The proposed approach involves fabrication of test vehicles with recommended materials, power cycling tests under specific conditions designed to meet the temperature fluctuation requirements, and structure function-based transient thermal analysis to estimate the thermal characteristics of the SiC power module. Our results underscore the importance of implementing a transient testing and analysis approach for SiC power modules to ensure their reliability in applications subjected to dynamic loads and switching conditions.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - Singapore’s First 8-inch SiC Pilot Line Programme - Double-side Cooling Power Mod.
Grant Reference no. : A20H9a0242