Ho, S. W., Boon Soh, S., Lau, B. L., Hsiang-Yao, H., & Rao, V. S. (2023, December 5). Development of Large RDL Interposer Package using RDL-first FOWLP Process. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc59621.2023.10457646
Abstract:
In this work, an organic RDL interposer with large package
size of 52 x 44 mm consisting of 12 embedded chiplets on a 60 x 60 mm organic substrate has been
demonstrated using RDL- first FOWLP process. 2 field masks stitching was used to create the large
interposer package size. 6 layers of high-density Cu RDL have been processed to meet the 12
chiplets interconnectivity and bandwidth performance requirements. Chiplets with micro-bumps were
assembled on the RDL with a mass reflow process and encapsulated with mold compound thus forming
the RDL interposer package. Electrical testing was conducted on the RDL test structures and the
chiplets and results show good electrical continuity across the stitched Cu RDL traces and
assembled chiplets. Shadow Moire warpage measurement was performed on the RDL interposer package to
characterize the warpage behavior during board assembly. The Shadow Moire results show a large
warpage change associated with the large RDL interposer during reflow process. A TCB technique was
used to assemble the RDL interposer to the organic build-up substrate, to reduce the package
warpage and enable the assembly of the RDL interposer to the organic
substrate.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - Applied Centre of Excellence in Advanced Packaging 3.0. (CEAP 3.0)
Grant Reference no. : I2101E0008