Wideband Circularly Polarized FOWLP Antenna in Package for Satellite Communications

Wideband Circularly Polarized FOWLP Antenna in Package for Satellite Communications

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

10.1109/ECTC51909.2023.00373

http://dx.doi.org/10.1109/ectc51909.2023.00373

Kai Bo Zheng, Mei Sun, Yong Xin Guo

03 August 2023

Zheng, K. B., Sun, M., & Guo, Y. X. (2023, May). Wideband Circularly Polarized FOWLP Antenna in Package for Satellite Communications. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc51909.2023.00373

This paper presents a wideband circularly-polarized Antenna-in-Package (AiP) element implemented in Fan-Out Wafer-Level-Packaging (FOWLP) technology for satellite communication. The AiP element features a meta-surface radiator with a single-ended aperture coupled feeding structure to achieve a wideband and circular polarization performance. By stacking a top mold of 500μm, a middle mold of 90μm and a 42μm RDL layer at the bottom, with a size of 10 mm×10 mm×0.652 mm, the AiP element achieves a Return Loss > 17.95 dB, an Axial Ratio < 2.67 dB, and a Gain of 7.19-7.88 dBi over 27–31 GHz. The antenna design concept is further confirmed using printed circuit board (PCB) technology for fast prototyping and evaluation.

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Institute of Microelectronics