Citation:
Dai, H., Dimitriadou, S., Sankara Rama Krishnan, P. S., Handoko, A. D., Recatala-Gomez, J., Wang, Y., Repaka, D. V. M., Thway, M., Zhang, C., Duchamp, M., & Hippalgaonkar, K. (2023). Sub-10 nm Mixing and Alloying of Cu–Ag and Cu–Ni via Accelerated Solid Diffusion. ACS Applied Materials & Interfaces, 15(23), 28398–28409. https://doi.org/10.1021/acsami.3c04124