Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers

Page view(s)
67
Checked on May 12, 2024
Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers
Title:
Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers
Journal Title:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
Keywords:
Publication Date:
05 January 2022
Citation:
Gourikutty, S. B. N., Jong, M. C., Kanna, C. V., Ho, D. S. W., Wu, J., Mandal, R., Li, N., Lim, T. G., Liow, J. T.-Y., & Bhattacharya, S. (2021). Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc53413.2021.9663971
Abstract:
There is an explosion in the volume of data generated, transmitted, processed, and stored across the internet after the wide usage of smartphones, high-performance computing, internet-of-things, and cloud services. To handle such data, high-performance optical transceivers are required. In this paper, a novel electronic-photonic heterogeneous integration solution based on fan-out wafer-level packaging which can be used for high-speed scalable optical engine is discussed. The packaged interconnects are optimized to handle high-speed signals for data center applications and the optical engine package is examined for warpage behavior. The photonic integrated circuit equipped with edge suspended coupler optical I/Os is integrated by employing special processing.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the Agency for Science, Technology and Research - Industry Alignment Fund – Industry Collaboration Project (IAF-ICP)
Grant Reference no. : I2001E0071
Description:
© 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISBN:
978-1-6654-1619-1
Files uploaded: