Chen, H., Han, Y., & Tang, G. (2021). Numerical investigation of the optimization on manifold microchannel heat sink towards the water-cooling limit. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc53413.2021.9663902
Abstract:
This study developed a three-dimensional unit-cell model consisting of microchannel and manifold structure and a synthesis method to investigate and optimize the thermal and hydraulic performance of the full-scale manifold microchannel heat sink by a hydraulic network model. The effects of geometric parameters in manifold and microchannel were studied numerically. Both hydraulic and thermal performances are considered in the Pareto optimization program to design parameters of the manifold microchannel heat sink. We studied the pressure and temperature distribution along the manifold to show that thermal performance degrades in the lower regions of the manifold. By investigating the manifold etching depth, we explained the different roles that inlet and outlet manifolds’ fins played in heat transfer. We demonstrated the possibility to further optimize the MMC heat sink given the cooling limitation of caloric thermal resistance of the coolant, and the approaches to reduce the convective thermal resistance by optimizing dimensional parameters of both microchannel and manifold simultaneously. With the optimization model, we estimate the possible cooling limit of a water-cooled manifold microchannel heat sink.
License type:
Publisher Copyright
Funding Info:
This research is supported by core funding from: Institute of Microelectronics
Grant Reference no. : NIL