This paper provides an update on projects undertaken in the FOWLP development line namely the AiP in FOWLP for mmWave Radar Consortium and the newly launched Chiplet Consortium. Some of notable process development on RDL technologies being developed for heterogeneous integration high density chiplet packaging and multi-layer wafer level mold encapsulation capabilities will also be updated.
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Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - IPP-IAF - Fan-Out Wafer-Level-Packaging (FO-WLP) Development Line - 1528100051
Grant Reference no. : 1528100051