Addressing the assembly challenges of Antenna-in-package

Page view(s)
53
Checked on Jul 14, 2024
Addressing the assembly challenges of Antenna-in-package
Title:
Addressing the assembly challenges of Antenna-in-package
Journal Title:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
Keywords:
Publication Date:
05 January 2022
Citation:
Lim, S. P. S., Chong, S. C., Wee, D. H. S., Seit, W. W., Soh, J. J., & Chai, T. C. (2021). Addressing the assembly challenges of Antenna-in-package. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc53413.2021.9663972
Abstract:
In the recent years, there is high demand to have a safe and comfortable driving environment. There is emerging trend of developing Advanced Driver Assistance systems to improve driving efficiency and safety. In addition, the autonomous driving gaining much more attention [1]. Thus, more lower cost and higher performance antennas are required for automotive systems. There are many reports and literature on antenna packaging solutions for 77-GHz automotive radar system. The Antenna in Package (AiP) is able to integrate a single transceiver chip along with antennas and baseband processor to form a complete system [2, 3].In this paper, a 2-layer mold FOWLP Antenna in Package is designed for 77 GHz automotive radar application. Die pick & place process and molding process are evaluated to achieve ± 10 um die shift capability. The 300mm Fanout molded wafer is 0.6 mm thick at a package size of 16 x 16 mm 2 after singulation. Detailed process parameters on pick and place, die shift compensation, molding and debonding process to achieve less than 10um die shift and protrusion will be discussed in this work. In addition, Xray showed no solder voids after solderball attachment process. Ductile failure mode is achieved after ball shear process.
License type:
Publisher Copyright
Funding Info:
This research is supported by core funding from: Institute of Microelectronics
Grant Reference no. : NIL
Description:
© 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISBN:
978-1-6654-1619-1
Files uploaded: