Dual Polarized FOWLP AiP for 5G Base Station Applications

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Dual Polarized FOWLP AiP for 5G Base Station Applications
Title:
Dual Polarized FOWLP AiP for 5G Base Station Applications
Journal Title:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
Keywords:
Publication Date:
05 January 2022
Citation:
Mei, S., & Guan, L. T. (2021). Dual Polarized FOWLP AiP for 5G Base Station Applications. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc53413.2021.9663942
Abstract:
This paper presents Fan-Out Wafer-Level-Packaging (FOWLP) based dual polarized Antenna-in-Package (AiP) array for 5 G base station applications. The AiP features the double molding chip facing up configuration with the heat sink to cater for high power applications. The AiP 2 × 2 array design and its method of forming scalable array are illustrated. The AiP element features meta-surface radiator and two sets of orthogonally arranged power divider aperture feeds to achieve the wideband performance and pure dual polarizations. With a size of 6.75 mm × 6.75 mm × 0.742 mm it shows a Return Loss >15 dB, an Isolation >20 dB, a Gain of 5.68-6.6dBi over the 24.25-27.5 GHz as well as pure dual polarized patterns; when integrated with chip by bond wires the AiP element keeps Isolation and pattern performance and has a Return Loss >11.5 dB and Gain of 5.38-6.5dBi over the same bandwidth.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - IAF-ICP
Grant Reference no. : I1901E0045
Description:
© 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISBN:
978-1-6654-1619-1
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