Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging

Page view(s)
72
Checked on Feb 11, 2025
Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging
Title:
Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging
Journal Title:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
Keywords:
Publication Date:
05 January 2022
Citation:
Long, L. B., Ho, D., Guan, L. T., Yao, H. H., Siang, L. P., & Jaafar, N. (2021). Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc53413.2021.9663975
Abstract:
In this paper, the fabrication process flow and results of Antenna-in-Package through fan-out wafer level packaging process were presented. This package at size 8.5mmx8.5mmx0.35mm, consists of three redistribution layers (RDL), two mold-compound layers (M.C) and 100μm height of through mold via (TMV) interconnects. The RF functional chips were flip-chip embedded into M.C, with dielectric and Cu metal RDL routing the interconnection, slot-patch antenna which built on top of the 2 nd molded compound was fabricated using the IME fan-out process technology. This paper demonstrated using mold-first fan-out packaging process approach to build RDL layers on RF functional chip. In addition, the opposite side of RDL was built and connected with the front side RDL through TMV interconnects. The second molding was used for TMV filling and act as dielectric layer to build antenna on top. Several process challenges and the solutions was discussed in this paper. Key process parameters were developed and optimized to meet the critical dimensions’ specifications, good thickness uniformity and low wafer warpage conditions.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - More-Than-Moore Design-For-Test Centre of Excellence
Grant Reference no. : 1525700050
Description:
© 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISBN:
978-1-6654-1619-1
Files uploaded: