Pitchappa, P., Kumar, A., Singh, R., Lee, C., & Wang, N. (2021). Terahertz MEMS metadevices. Journal of Micromechanics and Microengineering, 31(11), 113001. https://doi.org/10.1088/1361-6439/ac1eed
Abstract:
Abstract
Terahertz (THz) part of the electromagnetic spectrum (0.1–10 THz) holds the key for next-generation high-speed wireless communication, non-destructive biosensing, fingerprint chemical detection and imaging for astronomy and security surveillance. The limited THz response of naturally occurring materials had left a technological gap in the THz region of the electromagnetic spectrum. Artificially engineered materials termed as ‘metamaterials’, have shown great potential in THz wave interaction and its active counterpart termed as ‘metadevices’ have been widely reported for on-demand manipulation of THz waves. One of the most efficient means of realizing metadevices is to reconfigure the shape of unit cells and hence the corresponding THz response. The 50+ years of development in microelectromechanical systems (MEMS) and the wide array of microactuator designs provide a perfect platform to achieve structural reconfiguration of microscale metamaterial unit cells in both in-plane and out-of-plane directions. In this review, we present a comprehensive overview of various MEMS approaches adopted for the demonstration of THz metadevices, their advantages and limitations. The future research directions of THz MEMS metadevices are also discussed. The seamless integration of matured MEMS technology with incipient THz metamaterials provides significant advantages in terms of enhanced performances, advanced functionalities and large scale manufacturability, that is critical for the development of future THz technologies.
License type:
Attribution 4.0 International (CC BY 4.0)
Funding Info:
This research / project is supported by the Agency for Science, Technology and Research - AME Programmatic grant
Grant Reference no. : A18A5b0056