Air-Gap Technology With a Large Void-Fraction for Global Interconnect Delay Reduction

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Air-Gap Technology With a Large Void-Fraction for Global Interconnect Delay Reduction
Title:
Air-Gap Technology With a Large Void-Fraction for Global Interconnect Delay Reduction
Other Titles:
IEEE Transactions on Electron Devices
Publication Date:
25 August 2021
Citation:
Prawoto, C., Ma, Z., Xiao, Y., Raju, S., & Chan, M. (2021). Air-Gap Technology With a Large Void-Fraction for Global Interconnect Delay Reduction. IEEE Transactions on Electron Devices, 68(10), 5078–5084. https://doi.org/10.1109/ted.2021.3105086
Abstract:
With a goal of delay and power reduction in global buses, an air-gap technology for upper-layer interconnect is introduced. The fabrication process is discussed, utilizing h -BN as an air-gap capping layer to enable large voids. The suitability of an air-gap technology for integration into the upper-layer back-end-of-line (BEOL) interconnect is evaluated in terms of the void ratio to the adjacent-line spacing. Electrical measurements show that adjacent-line capacitance is reduced by 50%. Mechanical reliability is ensured by Young’s modulus above BEOL requirement. Moisture uptake into air gaps is prevented using a hydrophobic capping layer. The integration of air gaps in global buses results in a 41% and 60% reduction in delay and crosstalk in the worst case switching scenario, based on parameters in the 14-nm technology node. It allows a 72% reduction in the energy-delay product with optimally designed repeaters. For the same delay, power consumption in an air-gapped global bus is reduced by requiring 4× fewer repeaters.
License type:
Publisher Copyright
Funding Info:
This work was supported by the Guangdong Basic and Applied Basic Research Foundation under Grant GDST19EG20.
Description:
© 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISSN:
1557-9646
0018-9383
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