Large‐Scale Fabrication of Surface Ion Traps on a 300 mm Glass Wafer

Large‐Scale Fabrication of Surface Ion Traps on a 300 mm Glass Wafer

physica status solidi (b)

10.1002/pssb.202000589

http://dx.doi.org/10.1002/pssb.202000589

Jing Tao, Jean-Pierre Likforman, Peng Zhao, Hong Yu Li, Theo Henner, Yu Dian Lim, Wen Wei Seit, Luca Guidoni, Chuan Seng Tan

Electronic, Optical and Magnetic Materials, Condensed Matter Physics

01 May 2021

Tao, J., Likforman, J.-P., Zhao, P., Li, H. Y., Henner, T., Lim, Y. D., Seit, W. W., Guidoni, L., & Tan, C. S. (2021). Large‐Scale Fabrication of Surface Ion Traps on a 300 mm Glass Wafer. Physica Status Solidi (b), 258(7), 2000589. Portico. https://doi.org/10.1002/pssb.202000589

Herein, a large-scale fabrication of radio frequency (RF) surface ion traps on a 300 mm glass wafer using a standard foundry process is reported. Established wafer-level packaging process of electroplated Cu with Au finish is used to fabricate the surface electrodes directly on the glass wafer substrate. A trap is tested by loading it with laser-cooled 88Sr+ ions. The trap shows a stable operation with RF amplitudes in the range of 100–250 V at 33 MHz frequency. The ion lifetime is on the order of 30 min with laser cooling with a vacuum chamber pressure of ≈5 × 10−11 mbar. These results demonstrate the potential of large-size foundry glass substrates to realize scalable and integratable trapped ion-based quantum devices.

Publisher Copyright

This research / project is supported by the A*STAR - Quantum Technology for Engineering
Grant Reference no. : A1685b0005

This is the peer reviewed version of the following article: Tao, J., Likforman, J.-P., Zhao, P., Li, H. Y., Henner, T., Lim, Y. D., Seit, W. W., Guidoni, L., & Tan, C. S. (2021). Large‐Scale Fabrication of Surface Ion Traps on a 300 mm Glass Wafer. Physica Status Solidi (b), 258(7), 2000589. Portico. https://doi.org/10.1002/pssb.202000589 , which has been published in final form at 10.1002/pssb.202000589. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Use of Self-Archived Versions. This article may not be enhanced, enriched or otherwise transformed into a derivative work, without express permission from Wiley or by statutory rights under applicable legislation. Copyright notices must not be removed, obscured or modified. The article must be linked to Wiley’s version of record on Wiley Online Library and any embedding, framing or otherwise making available the article or pages thereof by third parties from platforms, services and websites other than Wiley Online Library must be prohibited

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