Wai, L. C., Wee, D. H. S., & Choong, C. S. (2021). Realization of High Aspect Ratio Through Mold Interconnect (TMI) using Vertical Wire. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc53413.2021.9663883
A wire bonding method with free end vertical wire is implemented. Through this method, it required a unique capillary with high-definition design, to achieve the high aspect ratio vertical interconnect requirement. These vertical wire act as through mold interconnect (TMI) for fan-out packaging. This paper showed that with the unique vertical wire profile, capillary design, as well as optimized parameters, the high aspect ratio of ∼18 through mold interconnect was achieved at 200μm bonded ball pitch with 2.0mil wire.
This research / project is supported by the A*STAR - IAF - Fan-out Wafer Level Packaging Development Line
Grant Reference no. : 1528100051