Reduced TCF, High Frequency, Piezoelectric Contour-Mode Resonators with Silicon-on-Nothing

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Reduced TCF, High Frequency, Piezoelectric Contour-Mode Resonators with Silicon-on-Nothing
Title:
Reduced TCF, High Frequency, Piezoelectric Contour-Mode Resonators with Silicon-on-Nothing
Journal Title:
2021 IEEE International Ultrasonics Symposium (IUS)
Keywords:
Publication Date:
12 November 2021
Citation:
Ghosh, S., Sharma, J., Ng, E. J., Goh, D. J., Merugu, S., Koh, Y., & Lal, A. (2021). Reduced TCF, High Frequency, Piezoelectric Contour-Mode Resonators with Silicon-on-Nothing. 2021 IEEE International Ultrasonics Symposium (IUS). https://doi.org/10.1109/ius52206.2021.9593752
Abstract:
This paper describes microelectromechanical systems (MEMS) contour mode resonators (CMRs) with 900MHz resonant frequencies suitable for radio frequency (RF) applications, using a ~2µm thick degenerately doped n-type silicon (Si) layer. The Silicon-on-Nothing (SON) process has been used to fabricate monocrystalline thin pre-released Si membranes over cavities with well-controlled thickness across the wafer. A thin layer of 15% scandium (Sc)-doped aluminum nitride (AIN) has been incorporated in the vertical stack of the CMRs for piezoelectric transduction. The CMRs were aligned to the <100> crystal orientation of a (100) Si substrate to obtain a reduced temperature coefficient of frequency (TCF) of - 7.4ppm/°C.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - Programmatic - Nanosystems at the Edge
Grant Reference no. : A18A4b0055
Description:
© 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISBN:
978-1-6654-0355-9
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