Han, Y., Chai, T. C., & Lim, S. S. H. (2021). AiP Component and Board Level Heat dissipation Analysis for Automotive Radar. 2021 IEEE 71st Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc32696.2021.00292
For mm-wave application, the size of package with antenna becomes very small, which poses critical challenge for heat dissipation issue. The function demand for high performance and higher duty-cycled condition makes the thermal issue even more severe. In this work, thermal performance investigation has been performed at package level and modules level, and thermal solutions have been designed for performance improvement. Thermal performance of the package is firstly evaluated at package level. For the module performance analysis, due to multiple packages are included, various heating conditions are studied to provide a comprehensive thermal analysis. The effects of thermal via in PCB, cavity filling blocks, and bottom heat spreader on module heat dissipation capability have been studied. Effective solutions have been obtained to maintain all chips safe even under worst case condition. Module level thermal solution is able to achieve ~12% further performance improvement for all working modes. The conclusions and results obtained have been used in AiP module co-design for automotive radar.