Piezoelectricity in Structural Adhesives and Application for Monitoring Joint Integrity via Guided Ultrasonic Waves

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Piezoelectricity in Structural Adhesives and Application for Monitoring Joint Integrity via Guided Ultrasonic Waves
Title:
Piezoelectricity in Structural Adhesives and Application for Monitoring Joint Integrity via Guided Ultrasonic Waves
Journal Title:
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
Publication Date:
19 August 2020
Citation:
Wong, Z. Z., Chen, S., Liu, M., Lim, S. H., Cui, F., & Yao, K. (2021). Piezoelectricity in Structural Adhesives and Application for Monitoring Joint Integrity via Guided Ultrasonic Waves. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 68(3), 777–783. doi:10.1109/tuffc.2020.3017760
Abstract:
In an adhesively bonded structure, utilizing the adhesive itself for monitoring the joint integrity can be beneficial in reduction of labor, time and potential human errors while avoiding problems associated with introduction of a foreign sensor component. This work started from the examination of effective piezoelectricity of commercial structural adhesives/sealants, and five of them were found to possess effective piezoelectric property, with effective piezoelectric coefficient d33 from -0.11 to -1.77 pm/V depending on frequency under substrate clamping condition. With stable piezoelectric response at least up to MHz, an epoxy adhesive with inorganic filler was selected for SHM feasibility demonstration via generating or sensing guided ultrasonic Lamb waves. The presence of disbond in the adhesive joint is detectable by comparing the Lamb waves signal with a reference baseline signal associated with an intact structure. The results show that the selected adhesive with piezoelectric response can perform the dual roles of structural bonding and ultrasonic joint integrity monitoring.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - Aerospace Program
Grant Reference no. : SERC Grant 1521500071

This research / project is supported by the National Research Foundation - Competitive Research Programme
Grant Reference no. : NRF CRP15 2015 04
Description:
© 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISSN:
1525-8955
0885-3010
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