Wong, Z. Z., Chen, S., Liu, M., Lim, S. H., Cui, F., & Yao, K. (2021). Piezoelectricity in Structural Adhesives and Application for Monitoring Joint Integrity via Guided Ultrasonic Waves. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 68(3), 777–783. doi:10.1109/tuffc.2020.3017760
Abstract:
In an adhesively bonded structure, utilizing the adhesive itself for monitoring the joint integrity can be beneficial in reduction of labor, time and potential human errors while avoiding problems associated with introduction of a foreign sensor component. This work started from the examination of effective piezoelectricity of commercial structural adhesives/sealants, and five of them were found to possess effective piezoelectric property, with effective piezoelectric coefficient d33 from -0.11 to -1.77 pm/V depending on frequency under substrate clamping condition. With stable piezoelectric response at least up to MHz, an epoxy adhesive with inorganic filler was selected for SHM feasibility demonstration via generating or sensing guided ultrasonic Lamb waves. The presence of disbond in the adhesive joint is detectable by comparing the Lamb waves signal with a reference baseline signal associated with an intact structure. The results show that the selected adhesive with piezoelectric response can perform the dual roles of structural bonding and ultrasonic joint integrity monitoring.
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Funding Info:
This research / project is supported by the A*STAR - Aerospace Program
Grant Reference no. : SERC Grant 1521500071
This research / project is supported by the National Research Foundation - Competitive Research Programme
Grant Reference no. : NRF CRP15 2015 04