Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high crossplane thermal conductivity (62−86 W m−1 K−1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam’s improved performance (20−30% improved
cooling, temperature decrease by ΔT of 44−24 °C).