Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging

Page view(s)
25
Checked on Jun 08, 2024
Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging
Title:
Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging
Journal Title:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
DOI:
Publication URL:
Keywords:
Publication Date:
30 May 2017
Citation:
Abstract:
The electrical interconnect technique of the advanced packaging process has been evolving. Generally, in order to provide increased functionality and performance in the same volume, the advanced packaging processes used multiple chips to integrate the systems into a single package. The development of these advanced packaging trends is being driven primarily by the rapid growth in mobile handheld devices such as smartphones. A lot of development and production are reached, inclusive of wafer level packaging, Cu pillar on through silicon via interposer, fan out wafer level packaged, and many more. The fine pitch copper pillar process is subjected to be replaced by the controlled collapse chip connection bump in the new system package designs. The wafer level packaging fabrication used the spun process of photo resist to plating the copper pillar. However, when the thicknesses of photo resist had been increased to 100μm, there are many process and manufacturing challenges; the thickness of photo resist coating and the uniformity of photo resist, throughput and costs of materials. And emerging as an attractive alternative is the use of dry film resist materials. Dry film photoresist materials were used not only on fabricating the PCB but also on WLP fabrication process in recent years.
License type:
PublisherCopyrights
Funding Info:
Description:
(c) 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
ISBN:

Files uploaded: