Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling

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Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling
Title:
Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling
Journal Title:
IEEE Transactions on Components, Packaging and Manufacturing Technology
Keywords:
Publication Date:
01 January 2017
Citation:
Y. Han, B. L. Lau, G. Tang, X. Zhang and D. M. W. Rhee, "Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 1, pp. 50-57, Jan. 2017. doi: 10.1109/TCPMT.2016.2627040
Abstract:
Microfluid cooling solution is one of the most effective techniques for thermal management of high heat fluxes. A jet-based Si microcooler with multiple drainage microtrenches (MDMTs) has been developed for microelectronic thermal management. Integrated with MDMT in hybrid microcooler, the negative cross-flow effect between nearby nozzles is eliminated, and thus fully developed jet impingement can be enabled for each nozzle. An inlet/outlet flow arrangement layer has been introduced to achieve uniform pressure distribution. The effects of three types of arrangement structures on the hydraulic and thermal performance of microcooler have been analyzed and compared. Two different thermal/fluid simulation models have been constructed for microcooler design. The test vehicle with the new nozzle/trench layer is fabricated using double-side deep reactive-ion etching process. Assembly of the stacked microcooler and Si thermal test chip is finished through two-steps optimized thermal compression bonding process. With 0.05-W pumping power for the microcooler, the heat dissipation of 260 W/cm2 has been demonstrated, and the chip temperature can be maintained under 51 °C. Excellent agreement has been obtained between experimental and simulation results. With the MDMT, enhanced microjet array impinging has been achieved, and uniform chip temperature distribution is obtained.
License type:
PublisherCopyrights
Funding Info:
Description:
(c) 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
ISSN:
2156-3985
2156-3950
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