3-D Modeling and Characterization for Die Attach Process

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3-D Modeling and Characterization for Die Attach Process
Title:
3-D Modeling and Characterization for Die Attach Process
Journal Title:
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
Keywords:
Publication Date:
01 October 2016
Citation:
L. Bu, W. L. Ching, H. S. Ling, M. W. Rhee and Y. P. Fen, "3-D Modeling and Characterization for Die Attach Process," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 10, pp. 1567-1575, Oct. 2016. doi: 10.1109/TCPMT.2016.2606112
Abstract:
A new 3-D model for the die attach (DA) process is established and validated in this paper. With this model, the fluid flow characteristics of the DA process can be predicted accurately. Dynamic mesh and interface tracking method were adopted in the modeling to study the compression motion and the front of DA. A force driven model was conducted for the parametric studies of different bonding forces. The model for the DA process was validated by the four materials, AP1, CA1, CA4, and DM60 in the optimized condition. Bond line thickness can be predicted by the simulation with ∼20% accuracy. The simulation results show that the viscosity is one of the key properties, which has a significant effect on the required bonding force, bonding time, and DA contamination on the die top. Complete filling and DA contamination on the die top are two important standards to evaluate the good bonding force range in fluid dynamic analysis. Stress analysis illuminates that a fillet area is very critical and experiences highest stress during the reflow process.
License type:
PublisherCopyrights
Funding Info:
Description:
(c) 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
ISSN:
2156-3950
2156-3985
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