Wafer-Scale Dies-Transfer Bonding Technology for Hybrid III/V-on-Silicon Photonic Integrated Circuit Application

Wafer-Scale Dies-Transfer Bonding Technology for Hybrid III/V-on-Silicon Photonic Integrated Circuit Application
Title:
Wafer-Scale Dies-Transfer Bonding Technology for Hybrid III/V-on-Silicon Photonic Integrated Circuit Application
Other Titles:
IEEE Journal of Selected Topics in Quantum Electronics
Keywords:
Publication Date:
14 April 2016
Citation:
X. Luo, Y. Cheng, J. Song, T. Y. Liow, Q. J. Wang and M. Yu, "Wafer-Scale Dies-Transfer Bonding Technology for Hybrid III/V-on-Silicon Photonic Integrated Circuit Application," in IEEE Journal of Selected Topics in Quantum Electronics, vol. 22, no. 6, pp. 1-12, Nov.-Dec. 2016.
Abstract:
In this paper, we review a variety of hybrid III/Von-silicon integration platforms with focus on the optical coupling between III/V and silicon waveguides. Numerical simulations with regard to the coupling efficiency are conducted for various mode overlapped and adiabatic-coupled structures for future design guideline. As a highlight, we show a novel wafer-scale dies-transfer bonding technology that features the merits of high bonding efficiency and process scalability for potential manufacturability of hybrid III/V-on-silicon photonic integrated circuit. Exemplary demonstration of up to 100 dies bonding to an 8-in processed silicon wafer is shown with ∼80% bonding yield, according to the C-mode scanning acoustic microscope characterization. As a proof-of-concept, hybrid silicon mode-locked lasers using the bonded wafer are demonstrated.
License type:
PublisherCopyrights
Funding Info:
Description:
(c) 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
ISSN:
1077-260X
1558-4542
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