F. X. Che, Y. Han, B. L. Lau and X. Zhang, "Design Optimization and Characterization of Silicon Microcooler System Through Finite-Element Modeling and Experimental Analyses," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 2, pp. 224-237, Feb. 2016.
Abstract:
As chip power densities are now increasing beyond air cooling limits, a variety of liquid cooling methods are being investigated. The silicon microchannel cooling (SMC) is an attractive approach due to its high heat transfer coefficient. In this study, a thermal test chip with heating spots was mounted onto a synthetic diamond heat spreader, and then mounted onto the SMC cooler through thermo-compression bonding (TCB) process. Finally, this structure was mounted onto the printed circuit board (PCB) and connected with the manifold. The reliability of the cooler system was investigated through finite element analysis (FEA) and characterization. Five types of FEA models were conducted considering process flow and application conditions, including shear test model, model of bonding the thermal chip to the heat spreader, model of whole cooler system assembly, thermo-mechanical coupling analysis model considering hotspot heating, and temperature cycling reliability test model. Die attach materials were evaluated based on shear test and modeling results. The cooler system was optimized based on FEA results to reduce stress and warpage. The thermo-mechanical coupling simulation was conducted for cooler system by considering temperature non-uniform distribution due to hotspots and cooling effect. Experimental results showed that the designed cooler system has good performance and reliability thermally and mechanically.
License type:
PublisherCopyrights
Funding Info:
Description:
(c) 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.