Songsong Zhang; Shih-Cheng Yen; Zhuolin Xiang; Lun-De Liao; Dim-Lee Kwong; Chengkuo Lee, "Development of Silicon Probe With Acute Study on In Vivo Neural Recording and Implantation Behavior Monitored by Integrated Si-Nanowire Strain Sensors," in Microelectromechanical Systems, Journal of , vol.24, no.5, pp.1303-1313, Oct. 2015
Abstract:
The silicon probe with highly P-doped Si electrodes was realized on 8-in Silicon on insulator wafer through
standard Complementary metal-oxide semiconductor process. By leveraging the same thin Si device layer (∼100 nm), the built-in piezo resistive Si-nano wires (SiNWs) configured in full bridge structure were also equipped along the probe shank for strain sensing. After additional coatings of nano composite (Carbon nano tubes + Au nano particles) on silicon electrodes, the functionality of neural recording was validated with a low noise level (
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