Doris Keh Ting Ng, Qian Wang, Jing Pu, Kim Peng Lim, Yongqiang Wei, Yadong Wang, Yicheng Lai, and Seng Tiong Ho, "Demonstration of heterogeneous III–V/Si integration with a compact optical vertical interconnect access," Opt. Lett. 38, 5353-5356 (2013)
Heterogeneous Si/III-V integration with a compact optical vertical interconnect access is fabricated and the light coupling efficiency between the Si/III-V waveguide and silicon nanophotonic waveguide is characterized. The III-V semiconductor material is directly bonded to the silicon-on-insulator substrate and etched to form the Si/III-V waveguide for a higher light confinement in the active region. The compact optical vertical interconnect access is formed through etching the III-V and SOI layer, which are tapered in the same direction. The measured Si/III-V waveguide has a light coupling efficiency of ~90% to the silicon photonic layer with the tapering structure. This heterogeneous and light coupling structure can provide an efficient platform for photonic system on chip including passive and active devices.