Chao Li, Koh Sing Chee, Jifang Tao, Huijuan Zhang, Mingbin Yu, and G. Q. Lo, "Silicon photonics packaging with lateral fiber coupling to apodized grating coupler embedded circuit," Opt. Express 22, 24235-24240 (2014) http://www.opticsinfobase.org/oe/abstract.cfm?URI=oe-22-20-24235
Abstract:
We report a novel lateral packaging approach using laser welding technique with angle polished fiber coupling to grating coupler embedded silicon photonic circuit. Measurements show the relax alignment
tolerance for fiber packaging process. The packaging excess loss of 1.2 dB is achieved. The use of angle polished fiber for lateral fiber coupling enables an alternative way for cost-effective deployment of silicon
photonics packaging in telecommunication systems.