Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration

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Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration
Title:
Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration
Other Titles:
IEEE Transactions on Components, Packaging and Manufacturing Technology
Keywords:
Publication Date:
01 September 2013
Citation:
Abstract:
In this paper, a 77-GHz automotive radar sensor transceiver front-end module is packaged with a novel embedded wafer level packaging (EMWLP) technology. The bare transceiver die and the pre-fabricated through silicon via (TSV) chip are reconfigured to form a molded wafer through a compression molding process. The TSVs built on a high resistivity wafer serve as vertical interconnects, carrying radio-frequency (RF) signals up to 77 GHz. The RF path transitions are carefully designed to minimize the insertion loss in the frequency band of concern. The proposed EMWLP module also provides a platform to design integrated passive components. A substrate-integrated waveguide resonator is implemented with TSVs as the via fences, and it is later used to design a second-order 77-GHz high performance bandpass filter. Both the resonator and the bandpass filter are fabricated and measured, and the measurement results match with the simulation results very well.
License type:
PublisherCopyrights
Funding Info:
Description:
ISSN:
2156-3950
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