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Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package

Study of C2W Bonding Using Cu Pillar with Side-wall Plated Solder

High-band AlN Based RF-MEMS Resonator for TSV integration

Process and Reliability of Large Fan-Out Wafer Level Package based Package-on-Package

Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging

High Vacuum and High Robustness Al-Ge Bonding for Wafer Level Chip Scale Packaging of MEMS Sensors

Extremely High Temperature and High Pressure (x-HTHP) Endurable SOI Device and Sensor Packaging for Harsh Environment Applications

Package-level Si Micro-fluid Cooler with Enhanced Jet Array for High Performance 3D Systems

Development of TSV electroplating process for via-last technology

Stealth Dicing Challenges for MEMS Wafer Applications

Passive Devices Fabrication on FOWLP and Characterization for RF Applications

A Novel Method for Air-gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ)

Electrical Characterization of CMP-less Via-Last TSV under Reliability Stress Conditions

Wafer-Level Vacuum-Packaged Piezoelectric Energy Harvesters Utilizing Two-Step Three-Wafer Bonding

Co-design for Low Warpage and High Reliability in Advanced Package yvith TSVFree Interposer (TFI)

Thin-film Magnetic Inductors for Integrated Power Management

Simulation Analysis of a Conformal Patch Sensor for Skin Tension and Swelling Detection

Biopackaging of minimally invasive ultrasound assisted clot lysis device for stroke treatment

A queue analytics system for taxi service using mobile crowd sensing

Cascade Subspace Clustering

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