Collection's Items (Sorted by Submit Date in Descending order): 1 to 20 of 160
| Issue Date | Title | Author(s) |
| 30-May-2017 | Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package | Chen, Zhaohui; Che, Faxing; Ding, Mian Zhi; Ho, David Soon Wee; Chai, Tai Chong; Srinivasa, Vempati |
| 30-May-2017 | Study of C2W Bonding Using Cu Pillar with Side-wall Plated Solder | Xie, Ling; Wickramanayaka, Sunil; Sekhar, Vasarla Nagendra; Cereno, Daniel Ismael |
| 30-May-2017 | High-band AlN Based RF-MEMS Resonator for TSV integration | Wang, Nan; Zhu, Yao; Sun, Chengliang; Yu, Mingbin; Chua, Gengli; Merugu, Srinivas |
| 30-May-2017 | Process and Reliability of Large Fan-Out Wafer Level Package based Package-on-Package | Rao, Vempati Srinivasa; Chong, Chai Tai; Ho, David; Zhi, Ding Mian; Choong, Chong Ser; Lim, Sharon PS; Ismael, Daniel; Liang, Ye Yong |
| 30-May-2017 | Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging | Leong, Yew Wing; Hsiao, Hsiang-Yao; Ho, David Soon Wee; Lau, Boon Long; Lin, Huamao |
| 30-May-2017 | High Vacuum and High Robustness Al-Ge Bonding for Wafer Level Chip Scale Packaging of MEMS Sensors | Xu, Jinghui; Ding, Zhipeng; Chidambaram, Vivek; Ji, Hongmiao; Gu, Yuandong |
| 30-May-2017 | Extremely High Temperature and High Pressure (x-HTHP) Endurable SOI Device and Sensor Packaging for Harsh Environment Applications | Au, K.Y.; Che, F.X.; Ching, Eva Wai Leong |
| 30-May-2017 | Package-level Si Micro-fluid Cooler with Enhanced Jet Array for High Performance 3D Systems | Han, Yong; Lau, Boon Long; Tang, Gongyue; Low, Seow Meng; Goh, Jason |
| 30-May-2017 | Development of TSV electroplating process for via-last technology | Hwang, Gilho; Kalaiselvan, Ravanethran |
| 30-May-2017 | Stealth Dicing Challenges for MEMS Wafer Applications | Cereno, Daniel Ismael; Wickramanayaka, Sunil |
| 30-May-2017 | Passive Devices Fabrication on FOWLP and Characterization for RF Applications | Wang, Chunmei; Chui, King Jien; Wang, Xiangyu; Lim, Teck Guan; Yu, Mingbin; See, Gilbert; Yu, Gu |
| 30-May-2017 | A Novel Method for Air-gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ) | Chui, King-Jien; Loh, Woon Leng; Wang, Xiangyu; Chen, Zhaohui; Yu, Mingbin |
| 30-May-2017 | Electrical Characterization of CMP-less Via-Last TSV under Reliability Stress Conditions | Chui, King-Jien; Yu, Mingbin |
| 30-May-2017 | Wafer-Level Vacuum-Packaged Piezoelectric Energy Harvesters Utilizing Two-Step Three-Wafer Bonding | Wang, Nan; Siow, Li Yan; Wong, Lionel You Liang; Sun, Chengliang; Ji, Hongmiao; Made, Darmayuda I; Chang, Peter; Zhang, Qingxin; Gu, Yuandong |
| 30-May-2017 | Co-design for Low Warpage and High Reliability in Advanced Package yvith TSVFree Interposer (TFI) | Che, F.X.; Ding, M.Z.; Han, Y.; Bhattacharya, S. |
| 30-May-2017 | Thin-film Magnetic Inductors for Integrated Power Management | Arasu, Muthukumaraswamy Annamalai; Chui, King Jien; Lim, Wei Yi; Yu, Jun; Soh, Serine; Leong, Yew Wing; Lin, Huamao; Wickramanayaka, Sunil |
| 30-May-2017 | Simulation Analysis of a Conformal Patch Sensor for Skin Tension and Swelling Detection | Lim, Ruiqi; Cheng, Ming-Yuan; Damalerio, Ramona; Chen, Weiguo |
| 30-May-2017 | Biopackaging of minimally invasive ultrasound assisted clot lysis device for stroke treatment | Damalerio, Ramona; Cheng, Ming-Yuan; Chen, Weiguo; Lou, Liang; Zhang, Songsong |
| 17-Jun-2016 | Compact highly-efficient polarization splitter and rotator based on 90° bends | Tan, Kang; Huang, Ying; Lo, Guo-qiang; Lee, Chengkuo; Yu, Changyuan |
| 21-Feb-2017 | Effectiveness of oxide trench array as a passive temperature compensation structure in AlN-on-silicon micromechanical resonators | Xie, Qingyun; Wang, Nan; Sun, Chengliang; Randles, Andrew; Singh, Pushpapraj; Zhang, Xiaolin; Gu, Yuandong |
Collection's Items (Sorted by Submit Date in Descending order): 1 to 20 of 160
